Mobile mother boards(HDI PCB) Base-material: FR-4 Board thickness: 1.0MM Six layers-HDI(1+4+1) Blind via hole Solder mask color: Green Liquid Photo Imageable Soldermask(LPI) Silkscreen: White(top) Surface Finish: Immersion Nickel gold + OSP(Entek) Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Final inspection and Microsection
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